Samsung GT-S7070

Disassembly Process

Samsung GT-S7070 La Fleur consists of various modules. This chapter describes the procedures for the complete unit disassembly. In addition, in between procedures, the detailed disassembly procedure of individual modules will be provided for your needs.

Disassemble REAR screw 6 points.(Be care of scratch and molding damage.)

Separate the REAR from the FRONT ass’y ( TOP → Right → Left → Bottom) (Be care of scratch and molding damage)

1) Disassemble the key FPCB from Front Rib.

2) Disassemble the TSP FPCB from connector.

3) Disassemble the Key and LCD connector.

Be care of damage to TSP FPCB

Separate the PBA from the FRONT ass’y.(Be care of damage to KEY FPCB)

Separate the LCD Braket from the FRONT 6 ass’y ( Right → Left ).

Separate the LCD from the LCD Braket.(Becare of damage to LCD FPCB.)